集成电路封装材料的表征

Foreword xi

Preface to the Reissue of the Materials Characterization Series xiii

Preface to Series xiv

Preface to the Reissue of Integrated Circuit Packaging Materials xv

Preface xvi

Contributors xix

IC PACKAGE RELIABILITY TESTING

MOLD COMPOUND ADHESION AND STRENGTH

MECHANICAL STRESS IN IC PACKAGES

MOISTURE SENSITMTY AND DELAMINATION

THERMAL MANAGEMENT

ELECTRICAL PERFORMANCE OF IC PACKAGES

SOLDERABILITY OF INTEGRATED CIRCUITS

HERMETICITY AND JOINING IN CERAMIC IC PACKAGES

ADVANCED INTERCONNECT TECHNOLOGY

APPENDIX： TECHNIQUE SUMMARIES

《集成电路封装材料的表征(英文)》的主要内容包括： Foreword；Preface to the Reissue of the Materials Characterization Series xiii；Preface to Series xiv；Preface to the Reissue of Integrated Circuit Packaging Materials xv；Preface xvi；Contributors xix等。