微机电系统基础 : 第2版

PREFACE

A NOTE TO INSTRUCTORS

NOTATIONAL CONVENTIONS

Chapter 1 Introduction

1.0 Preview

1.1 The History of MEMS Development

1.1.1 From the Beginning to 1990

1.1.2 From 1990 to 2001

1.1.3 2002 to Present

1.1.4 Future Trends

1.2 The Intrinsic Characteristics of MEMS

1.2.1 Miniaturization

1.2.2 Microelectronics Integration

1.2.3 Parallel Fabrication with Precision

1.3 Devices: Sensors and Actuators

1.3.1 Energy Domains and Transducers

1.3.2 Sensors Considerations

13.3 Sensor Noise and Design Complexity

1.3.4 Actuators Considerations

Summary

Problems

References

Chapter 2 First-Pass Introduction to Microfabrication

2.0 Preview

2.1 Overview of Microfabrication

2.2 Essential Overview of Frequently Used Microfabrication Processes

2.2.1 Photolithography

2.2.2 Thin Film Deposition

2.2.3 Thermal Oxidation of Silicon

2.2.4 Wet Etching

2.2.5 Silicon Anisotropic Etching

2.2.6 Plasma Etching and Reactive Ion Etching

2.2.7 Doping

2.2.8 Wafer Dicing

2.2.9 Wafer Bonding

2.3 The Microelectronics Fabrication Process Flow

2.4 Silicon-Based MEMS Processes

2.5 Packaging and Integration

2.5.1 Integration Options

2.5.2 Encapsulation

2.6 New Materials and Fabrication Processes

2.7 Process Selection and Design

2.7.1 Points of Consideration for Deposition Processes

2.7.2 Points of Consideration for Etching Processes

2.7.3 Ideal Rules for Building a Process Flow

2.7.4 Rules for Building a Robust Process

Summary

Problems

References

Chapter 3 Review of Essential Electrical and Mechanical Concepts

3.0 Preview

3.1 Conductivity of Semiconductors

3.1.1 Semiconductor Materials

3.1.2 Calculation of Charge Carrier Concentration

3.1.3 Conductivity and Resistivity

3.2 Crystal Planes and Orientations

3.3 Stress and Strain

3.3.1 Internal Force Analysis: Newton's Laws of Motion

3.3.2 Definitions of Stress and Strain

3.3.3 General Scalar Relation Between Tensile Stress and Strain

3.3.4 Mechanical Properties of Silicon and Related Thin Films

3.3.5 General Stress-Strain Relations

3.4 Flexural Beam Bending Analysis Under Simple Loading Conditions

3.4.1 Types of Beams

3.4.2 Longitudinal Strain Under Pure Bending

3.4.3 Deflection of Beams

3.4.4 Finding the Spring Constants

3.5 Torsional Deflections

3.6 Intrinsic Stress

3.7 Dynamic System, Resonant Frequency, and Quality Factor

3.7.1 Dynamic System and Governing Equation

3.7.2 Response Under Sinusoidal Resonant Input

3.7.3 Damping and Quality Factor

3.7.4 Resonant Frequency and Bandwidth

3.8 Active Tuning of Spring Constant and Resonant Frequency

3.9 A List of Suggested Courses and Books

Summary

Problems

References

Chapter 4 Electrostatic Sensing and Actuation

4.0 Preview

4.1 Introduction to Electrostatic Sensors and Actuators

4.2 Parallel-Plate Capacitor

4.2.1 Capacitance of Parallel Plates

4.2.2 Equilibrium Position of Electrostatic Actuator under Bias

4.2.3 Pull-in Effect of Parallel-Plate Actuators

4.3 Applications of Parallel-Plate Capacitors

4.3.1 Inertia Sensor

4.3.2 Pressure Sensor

4.3.3 Flow Sensor

4.3.4 Tactile Sensor

4.3.5 Parallel-Plate Actuators

4.4 Interdigitated Finger Capacitors

4.5 Applications of Comb-Drive Devices

4.5.1 Inertia Sensors

4.5.2 Actuators

Summary

Problems

References

Chapter 5 Thermal Sensing and Actuation

5.0 Preview

5.1 Introduction

5.1.1 Thermal Sensors

5.1.2 Thermal Actuators

5.1.3 Fundamentals of Thermal Transfer

5.2 Sensors and Actuators Based on Thermal Expansion

5.2.1 Thermal Bimorph Principle

5.2.2 Thermal Actuators with a Single Material

5.3 Thermal Couples

5.4 Thermal Resistors

5.5 Applications

5.5.1 Inertia Sensors

5.5.2 Flow Sensors

5.5.3 Infrared Sensors

5.5.4 Other Sensors

Summary

Problems

References

Chapter 6 Piezoresistive Sensors

6.0 Preview

6.1 Origin and Expression of Piezoresistivity

6.2 Piezoresistive Sensor Materials

6.2.1 Metal Strain Gauges

6.2.2 Single Crystal Silicon

6.2.3 Polycrystalline Silicon

6.3 Stress Analysis of Mechanical Elements

6.3.1 Stress in Flexural Cantilevers

6.3.2 Stress and Deformation in Membrane

6.4 Applications of Piezoresistive Sensors

6.4.1 Inertial Sensors

6.4.2 Pressure Sensors

6.4.3 Tactile Sensor

6.4.4 Flow Sensor

Summary

Problems

References

Chapter 7 Piezoelectric Sensing and Actuation

7.0 Preview

7.1 Introduction

7.1.1 Background

7.1.2 Mathematical Description of Piezoelectric Effects

7.1.3 Cantilever Piezoelectric Actuator Model

7.2 Properties of Piezoelectric Materials

7.2.1 Quartz

7.2.2 PZT

7.2.3 PVDF

7.2.4 ZnO

7.2.5 Other Materials

7.3 Applications

7.3.1 Inertia Sensors

7.3.2 Acoustic Sensors

7.3.3 Tactile Sensors

7.3.4 Flow Sensors

7.3.5 Surface Elastic Waves

Summary

Problems

References

Chapter 8 Magnetic Actuation

8.0 Preview

8.1 Essential Concepts and Principles

8.1.1 Magnetization and Nomenclatures

8.1.3 Selected Principles of Micro Magnetic Actuators

8.2 Fabrication of Micro Magnetic Components

8.2.1 Deposition of Magnetic Materials

8.2.2 Design and Fabrication of Magnetic Coil

8.3 Case Studies of MEMS Magnetic Actuators

Summary

Problems

References

Chapter 9 Summary of Sensing and Actuation Methods

9.0 Preview

9.1 Comparison of Major Sensing and Actuation Methods

9.2 Other Sensing and Actuation Methods

9.2.1 Tunneling Sensing

9.2.3 Optical Sensing

9.2.4 Field Effect Transistors

9.2.5 Radio Frequency Resonance Sensing

Summary

Problems

References

Chapter 10 Bulk Micromachining and Silicon Anisotropic Etching

10.0 Preview

10.1 Introduction

10.2 Anisotropic Wet Etching

10.2.1 Introduction

10.2.2 Rules of Anisotropic Etching-Simplest Case

10.2.3 Rules of Anisotropic Etching-Complex Structures

10.2.4 Forming Protrusions

10.2.5 Interaction of Etching Profiles from Isolated Patterns

10.2.6 Summary of Design Methodology

10.2.7 Chemicals for Wet Anisotropic Etching

10.3 Dry Etching and Deep Reactive Ion Etching

10.4 Isotropic Wet Etching

10.5 Gas Phase Etchants

10.6 Native Oxide

10.7 Special Wafers and Techniques

Summary

Problems

References

Chapter 11 Surface Micromachining

11.0 Preview

11.1 Basic Surface Micromachining Processes

11.1.1 Sacrificial Etching Process

11.1.2 Micro Motor Fabrication Process-A First Pass

11.2.3 Micro Motor Fabrication Process-A Second Pass

11.1.4 Micro Motor Fabrication Process-Third Pass

11.2 Structural and Sacrificial Materials

11.2.1 Material Selection Criteria for a Two-layer Process

11.2.2 Thin Films by Low Pressure Chemical Vapor Deposition

11.2.3 Other Surface Micromachining Materials and Processes

11.3 Acceleration of Sacrificial Etch

11.4 Stiction and Anti-stiction Methods

Summary

Problems

References

Chapter 12 Process Synthesis: Putting It All Together

12.0 Preview

12.1 Process for Suspension Beams

12.2 Process for Membranes

12.3 Process for Cantilevers

12.3.1 SPM Technologies Case Motivation

12.3.2 General Fabrication Methods for Tips

12.3.3 Cantilevers with Integrated Tips

12.3.4 Cantilevers with Integrated Sensors

12.3.5 SPM Probes with Actuators

12.4 Practical Factors Affecting Yield of MEMS

Summary

Problems

References

Chapter 13 Polymer MEMS

13.0 Preview

13.1 Introduction

13.2 Polymers in MEMS

13.2.1 Polyimide

13.2.2 SU-8

13.2.3 Liquid Crystal Polymer (LCP)

13.2.4 PDMS

13.2.5 PMMA

13.2.6 Parylene

13.2.7 Fluorocarbon

13.2.8 Other Polymers

13.3 Representative Applications

13.3.1 Acceleration Sensors

13.3.2 Pressure Sensors

13.3.3 Flow Sensors

13.3.4 Tactile Sensors

Summary

Problems

References

Chapter 14 Micro Fluidics Applications

14.0 Preview

14.1 Motivation for Microfluidics

14.2 Essential Biology Concepts

14.3 Basic Fluid Mechanics Concepts

14.3.1 The Reynolds Number and Viscosity

14.3.2 Methods for Fluid Movement in Channels

14.3.3 Pressure Driven Flow

14.3.4 Electrokinetic Flow

14.3.5 Electrophoresis and Dielectrophoresis

14.4 Design and Fabrication of Selective Components

14.4.1 Channels

14.4.2 Valves

Summary

Problems

References

Chapter 15 Case Studies of Selected MEMS Products

15.0 Preview

15.1 Case Studies: Blood Pressure (BP) Sensor

15.1.1 Background and History

15.1.2 Device Design Considerations

15.1.3 Commercial Case: NovaSensor BP Sensor

15.2 Case Studies: Microphone

15.2.1 Background and History

15.2.2 Design Considerations

15.2.3 Commercial Case: Knowles Microphone

15.3 Case Studies: Acceleration Sensors

15.3.1 Background and History

15.3.2 Design Considerations

15.3.3 Commercial Case: Analog Devices and MEMSIC

15.4 Case Studies: Gyros

15.4.1 Background and History

15.4.2 The Coriolis Force

15.4.3 MEMS Gyro Design

15.4.4 Single Axis Gyro Dynamics

15.4.5 Commercial Case: InvenSense Gyro

15.5 Summary of Top Concerns for MEMS Product Development

15.5.1 Performance and Accuracy

15.5.2 Repeatability and Reliability

15.5.3 Managing the Cost of MEMS Products

15.5.4 Market Uncertainties, Investment, and Competition

Summary

Problems

References

Appendix 1 Characteristics of Selected MEMS Materials

Appendix 2 Frequently Used Formula for Beams, Cantilevers, and Plates

Appendix 3 Basic Tools for Dealing with a Mechanical Second-order Dynamic System

Appendix 4 Most Commonly Encountered Materials

Appendix 5 Most Commonly Encountered Material Removal Process Steps

Appendix 6 A List of General Compatibility between General Materials and Processes

Appendix 7 Comparison of Commercial Inertial Sensors

Answers to Selected Problems

Index

《华章教育：微机电系统基础（英文版·第2版）》全面论述了微机电系统（MEMS）的基础知识，涵盖了MEMS技术的主要方面，同时引用了经典的MEMS研究论文和前沿的技术论文，为学生深入学习MEMS技术提供了指引。书中提炼出了四个典型的传感器实例：惯性传感器、压力传感器、流量传感器和触觉传感器，并介绍了利用不同原理、材料和工艺制造这些传感器的方法，既便于比较，又可以启发学生的创新意识并提高创新能力。《华章教育：微机电系统基础（英文版·第2版）》被美国斯坦福大学、伊利诺伊大学等选为教材。