化合物半导体加工中的表征

Preface to the Reissue of the Materials Characterization Series ix

Preface to Series x

Preface to the Reissue of Characterization of Compound

Semiconductor Processing xi

Preface xiii

Contributors xv

CHARACTERIZATION OF III—V THIN FILMS FOR

ELECTRONIC DEVICES

III—V COMPOUND SEMICONDUCTOR FILMS FOR

OPTICAL APPLICATIONS

CONTACTS

DIELECTRIC INSULATING LAYERS

OTHER COMPOUND SEMICONDUCTOR FILMS

DEEP LEVEL TRANSIENT SPECTROSCOPY： A CASE STUDY

ON GaAs

APPENDIX： TECHNIQUE SUMMARIES

《化合物半导体加工中的表征(英文)》的主要内容包括： Preface to the Reissue of the Materials Characterization Series ix；Preface to Series x；Preface to the Reissue of Characterization of CompoundSemiconductor Processing xi；Preface xiii；Contributors xv等。