硅加工中的表征
硅加工中的表征封面图

硅加工中的表征

(美) 布伦德尔 (Brundle,C.R.) , (美) 埃文斯 (Evans,C.A.) , (美) 斯特劳瑟 (Strausser,Y.E.) , 主编

出版社:哈尔滨工业大学出版社

年代:2013

定价:88.0

书籍简介:

硅加工中的表征一书综述了硅加工工程师所感兴趣的表征技术。日益严格的材料要求,比如降低阻挡层厚度,促进了对提高材料质量与性能的需求。为了满足这些高标准,加工工程师必须对微结构的先进表征技术及表面制备和沉积技术与微结构的关系有足够的了解。这本书涵盖了表征的最新进展,包括:检测表面清洁过程的有效性如形貌、残留物、化学反应;确定在硅基体上生长硅化物与阻挡层过程中硅的消耗量;检测铝基体上晶粒的生长与晶粒尺寸——对于电迁移效应与光刻非常重要;以及硅的选择性外延生长。

书籍目录:

Preface to the Reissue of the Materials Characterization Series ix

Preface to Series x

Preface to the Reissue of Characterization in Silicon Processing xi

Preface xii

Contributors xiv

APPLICATION OF MATERIALS CHARACTERIZATION TECHNIQUES TO SILICON EPITAXIAL GROWTH

1.1 Introduction 1

1.2 Silicon Epitaxial Growth 2

Basic Chemical Reactions 2, Precleaning Considerations 3,

Reactor Types 3

1.3 Film and Process Characterization 4

Crystal Quality 4, PrecleanQuality 6, Thickness 9, Dopant

Concentration and Dopant Profiling 12

1.4 Selective Growth 14

Basic Process Considerations 14, Defect Density and Growth

Morphology 15, Predean Quality 18, Thickness 18

1.5 Si1 _xGex Epitaxial Growth 18

Material Considerations 18, Reactor Types 19

1.6 Si1_ xGex Material Characterization 20

Composition and Thickness 20, Growth Morphology 22, Lattice

Strain and Critical Thickness 23, Relaxation Kinetics 24, Bandgap

Measurements 24, Interracial Abruptness and Outdiffusion 25,

Impurity Profiles 25

1.7 Summary 26

POLYSILICON CONDUCTORS

SILICIDES

ALUMINUM— AND COPPER—BASED CONDUCTORS

TUNGSTEN—BASED CONDUCTORS

BARRIER FILMS

APPENDIX: TECHNIQUE SUMMARIES

内容摘要:

This volume is one of a series originally issued under anotherimprint. The other volumes in this series are as follows:Characterization of Catalytic Materialsisrael E. Wachs;Characterization of Metals and AlloysPaul H. Holloway and P. N Vaidyanathan;Characterization of CeramicsRona/d E. Loehman;Characterization of PolymersNed J. Chou, Stephen R Kowalczyk, Ravi Saraf, and Ho—Ming Tong;Characterization in Compound Semiconductor ProcessingGary McGuire and Yale Strausser;Characterization of Integrated Circuit Packaging MaterialsThomas M. Moore and Robert G. McKenna;Characterization of Composite MaterialsHatsuo Ishida;Characterization of Tribological MaterialsWilliam A. Glaeser;Characterization of Optical MaterialsGregory J. Exarhos;Characterization of Organic Thin FilmsAbraham Ulman.

书籍规格:

书籍详细信息
书名硅加工中的表征站内查询相似图书
丛书名材料表征原版系列丛书
9787560342801
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出版地哈尔滨出版单位哈尔滨工业大学出版社
版次1版印次1
定价(元)88.0语种英文
尺寸23 × 16装帧平装
页数印数

书籍信息归属:

硅加工中的表征是哈尔滨工业大学出版社于2013.11出版的中图分类号为 TN305 的主题关于 半导体工艺-研究-英文 的书籍。